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WELLMID 2015,bonding and repair adhesive,Repair SMC,Repair GRP,Repair,FRP
WELLMID 2015,bonding and repair adhesive,Repair SMC,Repair GRP,Repair,FRP


Detailed introduction:

WELLMID 2015 is two component,room temperature curing epoxy paste adhesive;it is particularly recommended as bonding agent and repair adhesive for Metal and FRP,GRP,SMC industry. 

•  Room temperature curing thixotropic epoxy adhesive
•  Good mechanical strength
•  Strong bond with a wide variety of materials
•  Water proofing and good chemical resistance
•  Good gap filling properties 

3kg/Set

 


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